JPH0731593Y2 - 金属基板と樹脂ケースとの組合わせ構造 - Google Patents

金属基板と樹脂ケースとの組合わせ構造

Info

Publication number
JPH0731593Y2
JPH0731593Y2 JP1988136783U JP13678388U JPH0731593Y2 JP H0731593 Y2 JPH0731593 Y2 JP H0731593Y2 JP 1988136783 U JP1988136783 U JP 1988136783U JP 13678388 U JP13678388 U JP 13678388U JP H0731593 Y2 JPH0731593 Y2 JP H0731593Y2
Authority
JP
Japan
Prior art keywords
metal substrate
resin case
terminals
longitudinal direction
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988136783U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0258389U (en]
Inventor
正実 大山
耕一 吉田
寿年 福原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP1988136783U priority Critical patent/JPH0731593Y2/ja
Publication of JPH0258389U publication Critical patent/JPH0258389U/ja
Application granted granted Critical
Publication of JPH0731593Y2 publication Critical patent/JPH0731593Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1988136783U 1988-10-19 1988-10-19 金属基板と樹脂ケースとの組合わせ構造 Expired - Lifetime JPH0731593Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988136783U JPH0731593Y2 (ja) 1988-10-19 1988-10-19 金属基板と樹脂ケースとの組合わせ構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988136783U JPH0731593Y2 (ja) 1988-10-19 1988-10-19 金属基板と樹脂ケースとの組合わせ構造

Publications (2)

Publication Number Publication Date
JPH0258389U JPH0258389U (en]) 1990-04-26
JPH0731593Y2 true JPH0731593Y2 (ja) 1995-07-19

Family

ID=31397612

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988136783U Expired - Lifetime JPH0731593Y2 (ja) 1988-10-19 1988-10-19 金属基板と樹脂ケースとの組合わせ構造

Country Status (1)

Country Link
JP (1) JPH0731593Y2 (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5713832Y2 (en]) * 1975-06-13 1982-03-19
JPS5919447A (ja) * 1982-07-26 1984-01-31 Toshiba Corp 妨害波除去受信方式
JPS59158382U (ja) * 1983-04-09 1984-10-24 日本ビクター株式会社 割り基板装着ケ−ス

Also Published As

Publication number Publication date
JPH0258389U (en]) 1990-04-26

Similar Documents

Publication Publication Date Title
JPH0713191Y2 (ja) コネクタ
JPH0731593Y2 (ja) 金属基板と樹脂ケースとの組合わせ構造
JPS6291495U (en])
JP3620399B2 (ja) 電気機器の製造方法
US5291372A (en) Integral heat sink-terminal member structure of hybrid integrated circuit assembly and method of fabricating hybrid integrated circuit assembly using such structure
JP2587840B2 (ja) 床暖房パネルの安全装置
JPH06169108A (ja) 熱電素子
JPH0716299Y2 (ja) 端 子
JP3667916B2 (ja) 樹脂パッケージ型半導体装置、およびその製造方法
JPH0439957A (ja) 半導体パッケージの放熱具
JPH0631723Y2 (ja) 半導体装置
JPS629722Y2 (en])
JPS6239571Y2 (en])
JP2684863B2 (ja) 半導体装置
JPH0810204Y2 (ja) 半導体部品取付構造
JPH10163537A (ja) 熱電変換装置
JPH10289641A (ja) 電磁継電器
JPS6350853Y2 (en])
JP2521489Y2 (ja) パワーモジュールの放熱構造
JPH0411797Y2 (en])
JP3818899B2 (ja) 複合半導体装置の製造方法
JPS6241457Y2 (en])
JPS601508Y2 (ja) セラミックヒ−タ−装置
JPH0282560A (ja) 半導体装置
JPH0590336A (ja) テープキヤリアパツケージ